제 25회 반도체 대전 SEDEX
October 25 ~ 27 / COEX SEOUL
GANA CO.,LTD
Booth No.C229산업용 접착제, UV LED 경화기 , 정밀 Die bonder, Flip chip bonder, Wire bonder
Industrial adhesive, UV LED curing machine, 정밀 Die bonder, Flip chip bonder, Wire bonder
Gana Co., Ltd., a company specializing in bonding solutions, supplies One Bonding Solution, including cutting-edge equipment such as precision die bonder, flip chip bonder, and wire bonder, as well as various high-performance adhesives and curing equipment.
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10월 25일 | |||||||
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10월 27일 |